Si360™ is an in-source test and packaging sub-contractor. We offer turnkey solutions with one significant part being our commendable suite of test and product engineering capabilities that ensures post-packaging facilitization and Release to Production. With our state-of-the-art tools and tester portfolio and engineering dexterity we efficiently manage the product from design to production volume. We are experts in high-speed and high-pin device testing and characterization.
In the face of a growing array of diverse applications, improved product performances, heightened competition and market survival, semiconductor manufacturers are constantly innovating their products by creating innovative technologies, device structures, enhanced designs, etc. These modifications need a broad range of measurement and test validation solutions - where standard test solutions do not measure up any longer. With reducing time-to-market cycles and shorter product lifecycles, it is imperative to have test vendors that have a complete suite of test solutions - from R & D to production, test partners can curtail their costs of test and improve efficiencies and optimization.
Si360™ offers flexible and scalable test solutions that deliver the core testing capabilities at the same time allowing for unique adaptations to rapidly changing market requirements of this industry. We specialize in keeping pace with the expeditiously evolving test environment by our inherent engineering knowledge, high-accuracy ATE equipment, high-end testing capabilities that embody decades of test program development, device characterization and volume production testing of first-in-their-class products.
Si360™ designs and manufactures hardware in-house. We design in the controls through an accurately manufactured hardware, be it burn-in boards, loadboards, probe cards or any test or qualification fixtures to ensure 90% efficiency and optimization.
Our lab is geared to perform volume production tests for 300mm, 200mm and 150mm wafers. We have thin wafer handling capabilities. We do multi-site probing and are proficient in bake retention, bumped wafer probe supported by our electronic assembly capabilities such as die attach wafer mapping, wafer map generation, inkless probe etc.
Si360™ performs wafer-level testing both at hot and cold temperatures to detect any damage and failures. The yield from the wafer testing is subjected to electrical validation to test for functionality. Our advanced equipment allows for electronic dye marking and virtual binning according to pre-determined test limits. The binning data can be graphed, or logged, on a wafer map to trace manufacturing defects and mark bad chips.
Si360™ is an engineering intensive sub-contractor. Our engineering to staff ratio is 70:30. We have the capability to quickly turn around test programs as we have multiple dedicated engineers for each system. We specialize in major device types including Digital, Analog, RF, Memory, Mixed Signal, Microprocessors/Microcontrollers, Image Sensors and ASIC's.
Si360™ engineering will work with you to determine the migration paths for your technology and offer a value-driven and seamless transition to a cost-effective and optimized test solution.
We offer a state-of-the-art test laboratory specializing in high quality semiconductor test, high-speed characterization and parametric testing – all the way to production ramp. Our engineering will work with you to enhance yields and optimize test programs for long-term robustness.
Through our in-house assembly and test capabilities, assembled chips are immediately tested after packaging for final test. We perform high-speed, high-pin device testing on our revolutionary ATE tools. We offer multi-site testing to allow for reduced production time. Full temperature testing is performed from 55C to 150C. We are qualified to carry out custom test processing for military and high-end commercial flows.
For detailed information about our design capabilities, please contact our sales staff at firstname.lastname@example.org