Services: Anti-counterfeit Management

Anit Counterfiet

The semiconductor market is plagued with technology cloning, re-branding and mis-labeling of substandard or defective electronic components to imitate higher-qualification EEE parts. The re-marking is done on salvaged parts from scrapped assemblies or even stolen parts. Some parts are manufactured illegally from original molds and designs. The inherent hazards of such practices result in use of in-correct die, inferior product, packages without die, false ROHS classifications, etc.

Types of Counterfeit Electronic Components

Any available components re-coded to customer order

Reclaimed components for correct device type sold as new

Components re-coded to a higher grade part

Test failures from factory via unauthorized routes

New lower grade components remarked


Major Impacts

May not meet manufacturer’s specification

Poor yields when built into system

Latent ESD damage from poor handling, uncertain reliability

Mixed lots, lack of traceability

Potential negative impact on user’s reputation

Why is Counterfeiting so rampant?

Shorter product lifetimes

Obsolete components difficult to source

Current components on long lead times disrupt production

Buyers’ pressure to reduce cost of materials

Ready supply of reclaimed components from electronic scrap

Obsolete/high reliability grade parts command a higher price

How Si360™ can add value?

Si360™ has an overriding commitment to test for counterfeit devices and ensure unquestionable quality products to our customers. We have extensive knowledge of original manufacturers’ test protocols that facilitates us in detecting any suspect products or foul play.


Our physical analysis is at both die and package level. it makes it very easy for us to have in-depth knowledge of the original manufacturer’s product, design process, device application and specifications. Our product verification protocols are as follows:

ArrowVisual Inspection

  1. Evidence of Re-Marking
  2. Marking Quality
  3. Manufacturer’s Logo
  4. Evidence of Prior Marking Removal
  5. Evidence of Reclaim
  6. Lead Condition - Xrf Analysis

ArrowDocumentation Check

  1. Certificate of Compliance
  2. Date Codes
  3. Authenticity Of Lot Codes And Labels

ArrowDimensions And Marking

  1. Check Dimensions Against Manufacturer’s Drawing
  2. Solvent Resistance Testing
  3. Processing Documents

ArrowElectrical Testing

  1. Full Parametric Testing
  2. Curve Trace - Fingerprint Analysis Of Inputs/Outputs
  3. Full Temperature Range Testing
  4. Test Plan Designed Specifically For Dut

ArrowNon-Destructive Internal Analysis

  1. Micro Focus X-Ray
  2. Scanning Accoustic Microscopy
  3. X-Ray Fluorescence - Presence Of Die

ArrowDestructive Internal Analysis

  1. Detailed Examination Of Die And Construction
  2. Die Marking From Original Manufacturer
  3. Die Marking For Product Type
  4. Die Marking For Grade

ArrowReliability Check

  1. Infant Mortality Failures
  2. ESD Damage
  3. Burn-in
  4. Long-term Life Test